YMTC chuẩn bị sản xuất hàng loạt RAM LPDDR5X với tốc độ 9.600 MT/s

YMTC, known as a NAND Flash manufacturer, is reportedly preparing to start mass production of LPDDR5X memory. While it has been known for some time that YMTC plans to enter DRAM production alongside its main NAND Flash business, it was not widely known that the company had already begun low-scale manufacturing. According to Counterpoint Research, YMTC has been producing about 5,000 wafers per month of 16 Gb LPDDR5X DRAM running at 7,500 MT/s at its Fab 2 since October 2025. The company is now preparing to begin volume production of LPDDR5X memory with speeds of 9,600 MT/s at its Fab 3, using Vertical Channel Transistor (VCT) 4F² cell structure technology.

YMTC has a significant advantage with 3D silicon, which represents the next phase of memory evolution. With its Xtacking 4.0 technology, YMTC can separate memory cell wafers from peripheral logic circuits and combine them using hybrid bonding wafer-to-wafer stacking. Hybrid bonding creates a permanent bond between two silicon chips using embedded metal bumps that are fused together to form a single chip. Multiple dies or entire silicon wafers can be connected by stacking the back ends of two chips together.

Even if the company continues large-scale manufacturing of LPDDR5X, it can easily transition into 3D DRAM with its Xtacking 4.0 or possibly a future 5.0 iteration, which has yet to be seen. Micron recently confirmed that it will not bring 4F² DRAM to market, remaining focused on the 6F² layout used in today's DRAM until 3D DRAM arrives. YMTC, along with CXMT, is pushing for 4F² adoption first, which means that Chinese memory makers might have a slight advantage in cell design, despite being limited by DUV lithography tools. However, once 3D DRAM is ready for mass manufacturing, YMTC is one of the best-positioned companies to capitalize on it.